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ThermoSink 35-7 is a top-of-the-line silicone encapsulant, designed to protect against thermal shock. Perfect for PCB or automotive applications.

Resin Designs TechFilm is a product line consisting of high-performance, partially cured epoxy adhesive films. These specialized film adhesives are designed as alternatives to two-part liquid epoxies.

Resin Designs, a division of Chase Corporation, would like to take this opportunity to spotlight the ThermoSink line of electronics’ thermal management materials. The ThermoSink name includes a …

THERMOSINK 35-3 has been formulated to meet the demands of various industries, particularly in environments where efficient thermal conductivity is vital. The rapid curing at room temperature …

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Nov 7, 2023 · Resin Designs UV800FR is a single component, UV LED curable, acrylated urethane encapsulant. It has been tested and rated to UL V0 flammability ratings in PCB manufacture.

May 13, 2019 · Resin Designs UV 165-183 is uniquely designed for thick applications as both an adhesive and encapsulant where UL V0 fire ratings are critical.

Feb 20, 2023 · Resin Designs, a division of Chase Corporation, announces positive test results for their ThermoSink 35-6 thermally conductive electronics potting material. Recent independent testing has …