Thermal engineering research has increasingly focused on innovative system design and optimization to address global challenges in energy efficiency, ...
Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leadin ...
Through Ansys Channel Partner ecosystem, advanced engineering simulation and electronic design solutions will be rapidly deployed across Kaynes Semicon’s operations ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...
The figure shows the evolution of the microstructure of the melt pool under the influence of the simulated transient temperature field. Nucleated grains are represented in pink-purple plots, while ...
Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...
There are two golden rules to thermal design: start simple and start early. The heat-flow path from the junction to the ambient, usually air in the local environment, determines a component’s ...
It is fairly common to have a hotter than desired component on a PCB. Often, the way to control the heat from such a component is to (a) create a copper pad underneath it as solid as possible, and ...
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